SUBSTRATE FOR MOUNTING SEMICONDUCTOR, ITS PRODUCING METHOD, SEMICONDUCTOR PACKAGE USING IT AND ITS PRODUCING METHOD

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, ITS PRODUCING METHOD, SEMICONDUCTOR PACKAGE USING IT AND ITS PRODUCING METHOD

PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor excellent in miniaturization and densification, preventing package crack or breakage of wiring, and applicable to a highly reliable small semiconductor package, and to provide a method for producing the substrate for mounting...

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Hauptverfasser: TSUBOMATSU YOSHIAKI, INOUE FUMIO, YAMAGUCHI REIKO, MORIIKE MICHIO, NAMATAME KAZUHIKO, KAWASAKI RYOJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TSUBOMATSU YOSHIAKI
INOUE FUMIO
YAMAGUCHI REIKO
MORIIKE MICHIO
NAMATAME KAZUHIKO
KAWASAKI RYOJI
description PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor excellent in miniaturization and densification, preventing package crack or breakage of wiring, and applicable to a highly reliable small semiconductor package, and to provide a method for producing the substrate for mounting a semiconductor excellent in efficiency, a semiconductor package using it and a method for producing the semiconductor package. SOLUTION: In the substrate for mounting a semiconductor comprising a flexible insulating basic material, and a wiring conductor including a semiconductor chip connection terminal and an external connection terminal formed on one side thereof, the flexible insulating basic material is selected from polyphenylene sulfide, polyether etherketone and aramid. COPYRIGHT: (C)2004,JPO
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE FOR MOUNTING SEMICONDUCTOR, ITS PRODUCING METHOD, SEMICONDUCTOR PACKAGE USING IT AND ITS PRODUCING METHOD
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