SUBSTRATE FOR MOUNTING SEMICONDUCTOR, ITS PRODUCING METHOD, SEMICONDUCTOR PACKAGE USING IT AND ITS PRODUCING METHOD

PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor excellent in miniaturization and densification, preventing package crack or breakage of wiring, and applicable to a highly reliable small semiconductor package, and to provide a method for producing the substrate for mounting a semiconductor excellent in efficiency, a semiconductor package using it and a method for producing the semiconductor package. SOLUTION: In the substrate for mounting a semiconductor comprising a flexible insulating basic material, and a wiring conductor including a semiconductor chip connection terminal and an external connection terminal formed on one side thereof, the flexible insulating basic material is selected from polyphenylene sulfide, polyether etherketone and aramid. COPYRIGHT: (C)2004,JPO