MATERIAL AND MACHINE FOR POLISHING FLOOR

PROBLEM TO BE SOLVED: To provide a polishing material by which burnishing work can smoothly be performed without contacting with an outer frame in the periphery of the polishing material of a polishing machine and a burden on the polishing machine is small and to provide the polishing machine provid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUZUKI YOSHIHIRO, HARUKI TAKANOBU, SHIMONO NAOHIKO, KANAMARU HIROKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polishing material by which burnishing work can smoothly be performed without contacting with an outer frame in the periphery of the polishing material of a polishing machine and a burden on the polishing machine is small and to provide the polishing machine provided with the polishing material. SOLUTION: The polishing material for a floor is provided with a porous supporting body between thick fiber aggregations consisting of thick fibers of ≥150μm fiber diameter. As for the porous supporting body, an average 5% modulus strength at 70°C is at least 20N/5cm width and basis weight is ≤100g/m2. In addition, the porous supporting body is bonded to the thick fiber aggregations with an adhesive. The polishing machine is provided with the polishing material for the floor as a material abutting on a floor surface. COPYRIGHT: (C)2004,JPO