METHOD FOR MANUFACTURING MULTILAYER CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board wherein a step for forming a circuit pattern is simplified. SOLUTION: The method includes a through hole formation step to form a through hole 6 in a resin film 1, a conductive paste filling step to fill the through hole 6 with conductive paste 7, an ink pattern formation step where ink 20 containing metallic particles 21 of nanometer in particle size is jetted over a resin film 1 through an ink jet device 30 to form an ink pattern 2i on the surface thereof, a stacking step to stack a plurality of resin films 12-13 wherein the ink pattern 2i is formed on their surfaces after the through hole 6 is filled with the conductive paste 7, and a heating/pressing step where the stacked resin films 12-13 are heated and pressed by a thermal pressing pate to adhere them to eahc other and the conductive paste 7 and the ink pattern 2i are sintered. The ink pattern can be sintered at the same time when the resin films are adhered and the conductive paste is sintered, so that no step is required in a multilayer step by heating and pressing. COPYRIGHT: (C)2004,JPO