PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which firmly and reliably connects lead terminals to I/O parts on a sidewall and operates a semiconductor element housed in a semiconductor element housing package normally and stably for a long time. SOLUTION: This semiconductor element housin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIZU SHOJIRO, YASUI MASAKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!