PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which firmly and reliably connects lead terminals to I/O parts on a sidewall and operates a semiconductor element housed in a semiconductor element housing package normally and stably for a long time. SOLUTION: This semiconductor element housing package comprises: a base 1 composed of ceramics having a mounting part 1a for mounting a semiconductor element 7; line conductors 4 each penetrating the central part 1a of a sidewall 2 through each bottom face on two steps which are formed so as to be opposed to each other at the inner and outer faces of each sidewall 2 of the base 1; an I/O part 3 in which each lead terminal 6 is soldered to the line conductor 4 at the outer face side of the sidewall 2; two belt-shaped conductors 4b which are separately formed along both outer peripheral edges of each line 4 in the line direction on the bottom of line conductor 4 on the step at the outer face side of each sidewall 2; and coupling belt-shaped conductors 4c each coupling the terminals of the two belt-shaped conductors 4b at the inner face side of the sidewall 2 and mounting a lead terminal 6 on its upper face. COPYRIGHT: (C)2004,JPO