CONNECTION TYPE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR
PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates. SOLUTION: The first circuit substrate 1 and the secon...
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| creator | TAKIGUCHI MASAYUKI NOMOTO KAORU |
| description | PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates. SOLUTION: The first circuit substrate 1 and the second circuit substrate 2 are fixed to an auxiliary plate 3 by an adhesive agent 4 whereby an adhering area is remarkably enlarged, compared with a case wherein the circuit substrates are bonded at the side ends thereof. COPYRIGHT: (C)2004,JPO |
| format | Patent |
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SOLUTION: The first circuit substrate 1 and the second circuit substrate 2 are fixed to an auxiliary plate 3 by an adhesive agent 4 whereby an adhering area is remarkably enlarged, compared with a case wherein the circuit substrates are bonded at the side ends thereof. COPYRIGHT: (C)2004,JPO</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040520&DB=EPODOC&CC=JP&NR=2004146540A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040520&DB=EPODOC&CC=JP&NR=2004146540A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKIGUCHI MASAYUKI</creatorcontrib><creatorcontrib>NOMOTO KAORU</creatorcontrib><title>CONNECTION TYPE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR</title><description>PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | CONNECTION TYPE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR |
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