CONNECTION TYPE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR

CONNECTION TYPE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates. SOLUTION: The first circuit substrate 1 and the secon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKIGUCHI MASAYUKI, NOMOTO KAORU
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a connection type circuit substrate and the manufacturing method thereof capable of improving the relative positional accuracy of two sheets of circuit substrates and rigidly fixing both of the circuit substrates. SOLUTION: The first circuit substrate 1 and the second circuit substrate 2 are fixed to an auxiliary plate 3 by an adhesive agent 4 whereby an adhering area is remarkably enlarged, compared with a case wherein the circuit substrates are bonded at the side ends thereof. COPYRIGHT: (C)2004,JPO