SUBSTRATE CLEANING METHOD AND DEVICE THEREOF

PROBLEM TO BE SOLVED: To provide a substrate cleaning method and a device thereof, which are capable of removing particles with higher efficiency when a wafer substrate used for manufacturing a conductor device, a glass substrate used for manufacturing a liquid crystal panel, or an optical disk substrate is cleaned with the cleaning device using a cleaning solution to which ultrasonic waves are applied. SOLUTION: A plurality of the cleaning solutions to which ultrasonic waves are applied are used, and ultrasonic waves whose frequency is different from that of the ultrasonic waves given to one of the cleaning solutions are applied to the other cleaning solution. At least, one of ultrasonic nozzles 7 and 10 is so arranged to form discharging direction of its solution at an angle of 80° to 85° with the surface of the substrate, and the other nozzle is so arranged to form an included angle of 90° with the former, and the nozzles 7 and 10 are so arranged to make their solution discharge angles cross each other at a point on the surface of the substrate to improve the cleaning effect of the nozzles 7 and 10. As the result, the substrate cleaning device is capable of making its output energy (wave height) higher than that obtained at the maximum output of a high-frequency oscillating device, and its particle removing efficiency can be enhanced. COPYRIGHT: (C)2004,JPO