HIGH FREQUENCY CIRCUIT MOUNTED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a miniaturized high frequency circuit mounted substrate by suppressing an electromagnetic coupling between the signal lines on the substrate. SOLUTION: A ground line is provided between the signal lines in which the electromagnetic coupling should be suppressed. The...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGATA KOSAKU, MURASE ISAO, MURAI KOJI, IHATA KOUJI, HIEDA HARUHIKO, ECCHU MASAO, YOSHIDA KENJI, ASAO HIDEKI, MISU KOICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a miniaturized high frequency circuit mounted substrate by suppressing an electromagnetic coupling between the signal lines on the substrate. SOLUTION: A ground line is provided between the signal lines in which the electromagnetic coupling should be suppressed. The ground line is connected to a back ground surface of the substrate through a via hole plated with metal. Consequently, the electromagnetic coupling is suppressed. COPYRIGHT: (C)2004,JPO