RAPIDLY CURABLE CONDUCTIVE ADHESIVE COMPOSITION, CONDUCTIVE ADHESIVE FOR QUARTZ RESONATOR, USING THE COMPOSITION, AND QUARTZ RESONATOR BONDED BY USING IT

PROBLEM TO BE SOLVED: To provide a conductive adhesive composition which cures rapidly and gives low resistance in connection between the cured material and an adherend, and a quartz resonator bonded by using the composition. SOLUTION: The conductive adhesive composition contains (A) an organic comp...

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Bibliographische Detailangaben
Hauptverfasser:	ANDO NORIYOSHI, TAKIGAWA AKIO, TSUKAMOTO MICHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive adhesive composition which cures rapidly and gives low resistance in connection between the cured material and an adherend, and a quartz resonator bonded by using the composition. SOLUTION: The conductive adhesive composition contains (A) an organic compound containing a carbon-carbon double bond capable of reacting with an SiH group, (B) a silicon compound containing at least two SiH groups, (C) a hydrosilylation catalyst, (D) an adhesion improver, and (E) a conductive filler. It has a gel time on a hot plate at 120°C of 300sec. or shorter. COPYRIGHT: (C)2004,JPO