SUBSTRATE PROCESSING APPARATUS AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can process a substrate for wafer, etc., while high cleanliness is maintained and to provide a method of processing the same. SOLUTION: The substrate processing apparatus includes a center port 100 disposed fixedly at a center a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKEDA KAZUYASU, ISHIZAKI TADASHI, WATARI TORU
Format: Patent
Sprache:eng
Schlagworte:
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