SUBSTRATE PROCESSING APPARATUS AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can process a substrate for wafer, etc., while high cleanliness is maintained and to provide a method of processing the same. SOLUTION: The substrate processing apparatus includes a center port 100 disposed fixedly at a center a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKEDA KAZUYASU, ISHIZAKI TADASHI, WATARI TORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BEARINGS BLASTING CLEANING CLEANING IN GENERAL CYLINDERS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELEMENTS OR CRANKSHAFT MECHANISMS ENGINEERING ELEMENTS AND UNITS FLEXIBLE SHAFTS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PISTONS PREVENTION OF FOULING IN GENERAL ROTARY BODIES OTHER THAN GEARING ELEMENTS SEALINGS SEMICONDUCTOR DEVICES SHAFTS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can process a substrate for wafer, etc., while high cleanliness is maintained and to provide a method of processing the same. SOLUTION: The substrate processing apparatus includes a center port 100 disposed fixedly at a center and having at least one jet port for injecting a fluid on a surface, and a rotary housing part 200 rotatable around the center port 100 as a center. The housing part 200 has a top late 210 having a main surface opposed to the substrate W, and a lower housing 220 coupled to the top plate 210 and rotatably driven by a rotary drive member. The surface including the jet port of the center port 100 is offset from the main surface of the top plate 210. When the liquid is injected from the jet port, the substrate W is held in a non-contact state with the main surface of the top plate 210 and the surface of the center port 100. COPYRIGHT: (C)2004,JPO