METHOD OF MANUFACTURING SEMICONDUCTOR THIN FILM AND THIN FILM SEMICONDUCTOR ELEMENT AND PEELING DEVICE OF SEMICONDUCTOR THIN FILM

PROBLEM TO BE SOLVED: To provide a method and a device for easily controlling peeling of a semiconductor thin film formed on a porous layer from a semiconductor substrate and obtaining the semiconductor thin film of high quality with less damage in a peeling process. SOLUTION: In the method and the device, the semiconductor substrate is compulsorily bent and is fixed in a substrate holding part, and a wedge is slid while it is depressed to an end part of the porous layer from outside in a state where stress is accumulated in the substrate so as to peel the semiconductor thin film from the semiconductor substrate. When pressure is locally applied to the end part of the porous layer from outside in the state where stress is accumulated inside the semiconductor thin film and the porous layer, inner stress accumulated in the porous layer, or in a boundary between the porous layer and the semiconductor substrate or the semiconductor thin film is contributed to crushing of the porous layer, and an amount of pressurization of the wedge to the porous layer can be reduced. Consequently, the semiconductor thin film of high quality with less damage by peeling can be obtained. COPYRIGHT: (C)2004,JPO