SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which the density of a semiconductor device can be increased without lowering the manufacturing yield of the device nor increasing the manufacturing cost of the device. SOLUTION: The method of manufacturing the semico...
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| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which the density of a semiconductor device can be increased without lowering the manufacturing yield of the device nor increasing the manufacturing cost of the device. SOLUTION: The method of manufacturing the semiconductor device includes a step of forming a semicurable insulating resin film 3 on the rear surface of a semiconductor wafer 1 on the front surface of which a device pattern 2 including electrodes is formed, a step of bonding an adhesive sheet 4 on which a conductor pattern 7 including electrodes is formed to the resin film 3, and a step of peeling the adhesive sheet 4 by leaving the conductor pattern 7 on the resin film 3. COPYRIGHT: (C)2004,JPO |
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