METHOD FOR MANUFACTURING FOAMED MOLDED PRODUCT COMPRISING POLYPROPYLENE RESIN

PROBLEM TO BE SOLVED: To provide a method for manufacturing a thick-walled foamed molded product excellent in appearance in high foaming magnification while keeping the heat resistance of a polypropylene resin by arranging a foamed parison in a mold and closing the mold. SOLUTION: In the method for...

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Bibliographische Detailangaben
Hauptverfasser:	NAITO MASATO, KOGURE NAOCHIKA, AKIYAMA TERUYUKI, IMANARI ONORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a thick-walled foamed molded product excellent in appearance in high foaming magnification while keeping the heat resistance of a polypropylene resin by arranging a foamed parison in a mold and closing the mold. SOLUTION: In the method for obtaining the foamed molded product by forming a cylindrical foam having a foamed layer by extruding a foamable molten resin, which is prepared by adding a foaming agent to a base resin, from an annular die and holding the cylindrical foam between molds in a softened state to mold the same, 20-70 wt.% of a polypropylene resin (a) with a melt tension of > 100 mN and a melt flow rate of 0.5-15 g/10 min and 30-80 wt.% of polypropylene resin (b) with a melt tension of < 30 mN and a melt flow rate of 2-30 g/10 min are used as the substrate resin. COPYRIGHT: (C)2004,JPO