PACKAGE FOR CONTAINING OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To operate an optical semiconductor device normally and stably over a long period of time by improving a coupling efficiency of an optical signal between a plurality of optical fibers and an optical semiconductor device. SOLUTION: The package for an optical semiconductor device comprises a substrate 1 including a placement section 1a of an optical semiconductor device on an upper surface thereof, an optical fiber introduction section 2c mounted on the upper surface of the substrate 1, and including on one side thereof an input/output terminal mounting section 2a and comprising a substantially U shaped groove formed in an upper surface of another side thereof for brazing thereof through an optical fiber, a frame 2 having a cover brazed to the upper surface, and an input/output terminal 4, the frame 2 being adapted such that a plated layer for brazing is formed on the upper surface of the side, and a non-formation section 10 of the plated layer is provided at a location along an inner periphery of the frame 2 of the optical fiber introduction section 2c and of the upper surface of the upper surface of the sides of the same. Hereby, the coupling efficiency of an optical signal between the optical fiber and the optical semiconductor device can be improved, and the optical semiconductor device can be normally and stably operated over a long period of time. COPYRIGHT: (C)2004,JPO