SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To efficiently check contact between a probe and a pad by using an inexpensive and convenient measuring instrument when a circuit operation is analyzed for failure by observing the internal signal waveform. SOLUTION: The semiconductor device is provided with a test pad 11 to in...
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Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To efficiently check contact between a probe and a pad by using an inexpensive and convenient measuring instrument when a circuit operation is analyzed for failure by observing the internal signal waveform. SOLUTION: The semiconductor device is provided with a test pad 11 to input a signal for contact checking and a monitor pad 12 to output the result of contact checking to the outside. Rectifier elements 19, 21 and 23 and switching elements 20, 22 and 24 are connected respectively in series between external connection pads 16, 17 and 18 for inputting or outputting signals and the monitor pad 12, and the test pad 11 is connected with input terminals for controlling the switching elements 20, 22 and 24. COPYRIGHT: (C)2004,JPO |
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