POLISHING DEVICE

PROBLEM TO BE SOLVED: To perform high quality polishing by uniformly supplying slurry liquid from the whole of a polishing surface of a polishing device and preventing deformation of buff. SOLUTION: In this device, a rotation center of a workpiece and a rotation center of a polishing plate 16 are ec...

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Bibliographische Detailangaben
1. Verfasser:	YAMAGISHI KATSUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To perform high quality polishing by uniformly supplying slurry liquid from the whole of a polishing surface of a polishing device and preventing deformation of buff. SOLUTION: In this device, a rotation center of a workpiece and a rotation center of a polishing plate 16 are eccentrically arranged. A buff sticking surface of the polishing plate 16 is coated with the buff made of a material for infiltrating the slurry liquid. At the inside of the polishing plate 16, flow passages 16a and 16b for supplying the slurry liquid by infiltrating the buff from an adhering surface side of the buff adhered to the buff sticking surface are provided. A plurality of slurry flow grooves 18 communicated with the flow passage 16b and formed into linear shapes to extend from a center part side of the buff sticking surface to an outer peripheral part side are provided at intervals in a peripheral direction on the buff sticking surface of the polishing plate 16. COPYRIGHT: (C)2004,JPO