LEAD TERMINAL STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a lead terminal structure of electronic components, capable of enhancing a joining strength between a lead terminal and a conductive pattern of a circuit board vis solder. SOLUTION: In the lead terminal structure of electronic components, for an electronic component...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIKAMI SHINICHIRO, ARAGAKI MASAHIDE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a lead terminal structure of electronic components, capable of enhancing a joining strength between a lead terminal and a conductive pattern of a circuit board vis solder. SOLUTION: In the lead terminal structure of electronic components, for an electronic component 2, which comprises a base, through which metal lead terminals 21, 22 are penetrated to be fixed thereto, an electronic component device connected electrically to the lead terminal and a cap for coating the base to hermetically seal the electronic device, a bent section 23 and a broad section 24 are formed in an outer lead part of the lead terminal of the electronic component, to constitute a conductive connection section with the circuit board and it is jointed to the conductive pattern of the circuit board via the solder. The board part of the lead terminal is formed, with at least a flat part opposing the circuit board in the bottom thereof and a curvature part on the side thereof. COPYRIGHT: (C)2004,JPO