MANUFACTURING METHOD OF CERAMIC ELECTRONIC PART
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic electronic part by which delamination which occurs at baking can be reduced. SOLUTION: A first ceramic coating layer 51 is formed on a base 19. A first group 61 of electrodes is formed. A second ceramic coating layer 52...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic electronic part by which delamination which occurs at baking can be reduced. SOLUTION: A first ceramic coating layer 51 is formed on a base 19. A first group 61 of electrodes is formed. A second ceramic coating layer 52 is formed. A second group 62 of electrodes is formed. A third ceramic coating layer 53 whose thickness t2 is equal to a difference between the thickness t1 of the first ceramic coating layer 51 and the thickness t2 of the second ceramic coating layer 52 is formed. The first ceramic coating layer 51 is peeled off from the base 19 and a multilayer sheet 70 is formed. A plurality of multilayer sheets 70 are stacked on each other. COPYRIGHT: (C)2004,JPO |
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