TILT SENSING DEVICE

PROBLEM TO BE SOLVED: To realize a structure of a tilt sensing device having very small size and high reliability which can be manufactured with a good productivity. SOLUTION: The device is provided with a first silicon substrate chip 20 having a concave part 21 at the center, a second silicon substrate chip 30 having an opening at the center and bonded on the first silicon substrate chip 20, and an iron ball 60 contained in the concave part 21. The concave part 21 is formed by anisotropically etching a single crystal silicon wafer, with an opening of a square cone shape, whose bottom face 23 is in parallel with a crystal face (100) and four tilted side faces 24, 25, 26, 27 surrounding it are in parallel with a crystal face (111). COPYRIGHT: (C)2004,JPO