POLYETHYLENE-BASED RESIN COMPOSITION AND FILM COMPRISING THE SAME AND USED FOR RETORT PACKAGE

PROBLEM TO BE SOLVED: To provide a polyethylene-based resin composition giving a film having excellent thermal fusion resistance and having transparency, rigidity, tensile strength and impact strength in an excellent balance, and to provide a film comprising the composition and used for retort packa...

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Bibliographische Detailangaben
Hauptverfasser: CHIKANARI KENZO, KAWADA ATSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyethylene-based resin composition giving a film having excellent thermal fusion resistance and having transparency, rigidity, tensile strength and impact strength in an excellent balance, and to provide a film comprising the composition and used for retort packages. SOLUTION: This polyethylene-based resin composition comprises 10 to 50 pts. wt. of an ethylene-α-olefin copolymer obtained in the presence of a metallocene catalyst and having an MFR of 0.01 to 10 g/10 min and a density of 890 to 925 kg/m3, 10 to 30 pts. wt. of an ethylene-α-olefin copolymer obtained in the presence of a metallocene catalyst and having an MFR of 1 to 100 g/10 min and a density of 930 to 945 kg/m3, and 20 to 80 pts. wt. of high density polyethylene having an MFR of 1 to 100 g/10 min and a density of 948 to 970 kg/m3, and has an MFR of 0.5 to 10 g/10 min and a density of 925 to 960 kg/m3. The film for retort packages comprises the polyethylene-based resin composition. COPYRIGHT: (C)2004,JPO