PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a structure of a package substrate for mounting a semiconductor element which ensures higher position accuracy and a low manufacturing cost, and also to provide a method of manufacturing the same. SOLUTION: The package substrate has a shape in which bottomed-holes ha...

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Bibliographische Detailangaben
Hauptverfasser:	TSUBOMATSU YOSHIAKI, WAKABAYASHI AKIHIKO, NAKAGAWA MITSUTOSHI, NAMATAME KAZUHIKO, TAMURA TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a structure of a package substrate for mounting a semiconductor element which ensures higher position accuracy and a low manufacturing cost, and also to provide a method of manufacturing the same. SOLUTION: The package substrate has a shape in which bottomed-holes having a plurality of shapes are formed and the interlayer connections are made in a plurality of layer, and also has a structure that the connections are made after a conductive process with only a single process of plating or with thick nonelectrolyte plating or with conductive paste. COPYRIGHT: (C)2004,JPO