ELECTRONIC PART PACKAGING APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic part packaging apparatus which can flexibly increase or decrease the number of workers following the change in the number of products. SOLUTION: The electronic part packaging apparatus includes a packaging facility 1 for packaging an electronic part on...

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Bibliographische Detailangaben
1. Verfasser: NISHII YUTAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic part packaging apparatus which can flexibly increase or decrease the number of workers following the change in the number of products. SOLUTION: The electronic part packaging apparatus includes a packaging facility 1 for packaging an electronic part on a printed board by the manual work of a worker H, a solder tank 2 for soldering the packaged part to the board, and a processing facility 3 for visually confirming the soldered state of the soldered part by the worker H as needed to correct it. These elements are arranged in a series of a line in this order. A return conveyor 4 is interposed between the facility 1 and the facility 3 to align the facility 1 and the facility 3 near at each other so that the conveyor lines of them moves in a reverse direction (α, β). COPYRIGHT: (C)2004,JPO