SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC EQUIPMENT

PROBLEM TO BE SOLVED: To provide an inexpensive TCP and FPC capable of facilitating countermeasures to multiple pin arrangement and narrow pitch structure by a conventional facility, and to realize its manufacturing method. SOLUTION: An exclusive connecting terminal is arranged like a land-shaped st...

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Bibliographische Detailangaben
Hauptverfasser:	MAKITA YOSHIHIRO, ENDOU KIYOHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an inexpensive TCP and FPC capable of facilitating countermeasures to multiple pin arrangement and narrow pitch structure by a conventional facility, and to realize its manufacturing method. SOLUTION: An exclusive connecting terminal is arranged like a land-shaped stage or lattice for improving peel strength, and connecting land outline dimension width is set as a testable land size so that the dual use of a test terminal and the connecting terminal can be realized. COPYRIGHT: (C)2004,JPO