SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor chip and a semiconductor device wherein the spacing between conductors for connecting pads and leads is adjustable and contact between conductors can be avoided, especially, at the corners of a semiconductor chip. SOLUTION: The semiconductor chip 1 is so constituted that pads 2 and 3 are arranged in two rows along the periphery of the chip. The pads are so designed that the length L3of pads 3 in either row along the periphery of the chip is larger than the length L2of pads 2 in the other row along the periphery of the chip. The pads 2 and 3 are so arranged that the outer side 3' of the pads 3 in either row relative to the center lines 5 of the semiconductor chip and the outer side 2' of the pads 2 in the other row relative to the center lines 5 are at an equal distance from the center lines 5. COPYRIGHT: (C)2004,JPO