METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can shorten time necessary for bonding and reduce overshooting of a bonding head. SOLUTION: Performance of a first bonding head to which a bonding tool is attached, and performance of a second bonding head, to which the first bonding head is attached, are started at the same time. At a time t4later than a time t3, when performance of the second bonding head is ended, first control information for moving the first bonding head to a first termination position, where high speed performance is ended is output from a main controller to an operation controller. When the first bonding head has a prescribed speed at the first termination position, the first bonding head is operated by switching from high-speed operation to low-speed operation. COPYRIGHT: (C)2004,JPO