SEMICONDUCTOR INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To provide a signal line where a high speed or coupling noise reduction is realized while keeping high density. SOLUTION: This circuit has an in-circuit wiring constituting a first circuit and a second circuit having a prescribed circuit function, and an inter-block wire connec...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OTA HIROYUKI, SHIOTSUKI YAHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a signal line where a high speed or coupling noise reduction is realized while keeping high density. SOLUTION: This circuit has an in-circuit wiring constituting a first circuit and a second circuit having a prescribed circuit function, and an inter-block wire connecting the first circuit and the second circuit. The inter-block wire consists of a first wire consisting of a first wiring layer among multilayer wires, a second wire consisting of a second wiring layer different from the first wiring layer, and a contact hole for connecting the first wire with the second wire. Further, the wire is provided with intersection parts for replacing adjacent wires with each other to differentiate the combination of the wires between the intersection parts. COPYRIGHT: (C)2004,JPO