SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To solve the problem that, when a semiconductor module and a heat sink are tightened, the semiconductor module is not retained uniformly, because the tightening force only acts on the vicinities of screws. SOLUTION: In a semiconductor device, a semiconductor chip 6 is sealed wi...

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Bibliographische Detailangaben
1. Verfasser:	MATSUO HARUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the problem that, when a semiconductor module and a heat sink are tightened, the semiconductor module is not retained uniformly, because the tightening force only acts on the vicinities of screws. SOLUTION: In a semiconductor device, a semiconductor chip 6 is sealed with a resin and a spring 10 having a pent-roof type cross-sectional shape is arranged on one side of a semiconductor module 9 having screw through holes 4 and 5 at its central part. The semiconductor module 9 is fixed to a heat sink 8 arranged on the side opposite to the arranged side of the spring 10 with screws 11 inserted into the holes 4 and 5 through the spring 10 from the arranged side of the spring 10. COPYRIGHT: (C)2004,JPO