SLURRY MANAGEMENT METHOD AND DEVICE FOR WIRE SAW

PROBLEM TO BE SOLVED: To surely recover the dispersion liquid from a waste slurry of a wire saw with high efficiency. SOLUTION: This device comprises the wire saw performing the cutting while introducing the slurry prepared by dispersing an abrasive into the dispersion liquid, a vacuum drying machin...

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Bibliographische Detailangaben
Hauptverfasser:	MUKAI HIROSHI, FUNAKI KEIZO, KAJITANI HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To surely recover the dispersion liquid from a waste slurry of a wire saw with high efficiency. SOLUTION: This device comprises the wire saw performing the cutting while introducing the slurry prepared by dispersing an abrasive into the dispersion liquid, a vacuum drying machine 28 to which the waste slurry 8 generated from the wire saw is introduced for separating a solid matter 19 and evaporated vapor 5a by drying the same in vacuum while heating the waste slurry at more than an evaporating temperature of the dispersion liquid 5, condensers 43, 44 communicated to the vacuum drying machine 28 at one side and communicated to a vacuum suction device 45 at the other side for liquefying the evaporated vapor 5a from the vacuum drying machine 28, and a dispersion liquid reserving tank 25 for reserving the dispersion liquid 5 liquefied by the condensers 43, 44. COPYRIGHT: (C)2004,JPO