LAPPING DEVICE, ABRASIVE DISC AND BOARD LAPPING METHOD

PROBLEM TO BE SOLVED: To properly lap a board made of a hard material by improving the affinity of an abrasive disc and abrasive liquid. SOLUTION: This lapping device includes the rotatable abrasive disc 1. The abrasive disc 1 has an abrasive face 1a to which the board is pressed. A part facing at l...

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Bibliographische Detailangaben
Hauptverfasser:	KANEKAWA AKIHIRO, MATSUI TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To properly lap a board made of a hard material by improving the affinity of an abrasive disc and abrasive liquid. SOLUTION: This lapping device includes the rotatable abrasive disc 1. The abrasive disc 1 has an abrasive face 1a to which the board is pressed. A part facing at least the abrasive face 1a of the abrasive disc 1 is made of iron of 99.95 % purity or higher. COPYRIGHT: (C)2004,JPO