BONDING TOOL

BONDING TOOL

PROBLEM TO BE SOLVED: To stably measure the amplitude at the tip of a bonding tool during bonding operation with an ultrasonic wave horn, even if an ultrasonic wave vibration is applied in the direction vertical to a bonding surface. SOLUTION: An ultrasonic wave vibrator system 26 press contacts a t...

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Hauptverfasser: IKETANI YUKIHIRO, AIZAWA TAKAHIRO, OTANI KAZUMI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator IKETANI YUKIHIRO
AIZAWA TAKAHIRO
OTANI KAZUMI
description PROBLEM TO BE SOLVED: To stably measure the amplitude at the tip of a bonding tool during bonding operation with an ultrasonic wave horn, even if an ultrasonic wave vibration is applied in the direction vertical to a bonding surface. SOLUTION: An ultrasonic wave vibrator system 26 press contacts a tip to an electronic component 4 for pressurizing, and generates ultrasonic wave vibration in the pressurizing direction. A through hole 16 is formed on the ultrasonic wave vibrator system 26 from its base end toward tip side. A laser vibration meter 17A radiates laser beam to the tip through the through hole 16 to observe a reflected light and measures the amplitude at the tip end of the ultrasonic wave vibrator system 26. COPYRIGHT: (C)2004,JPO
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title BONDING TOOL
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