BONDING TOOL

PROBLEM TO BE SOLVED: To stably measure the amplitude at the tip of a bonding tool during bonding operation with an ultrasonic wave horn, even if an ultrasonic wave vibration is applied in the direction vertical to a bonding surface. SOLUTION: An ultrasonic wave vibrator system 26 press contacts a t...

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Bibliographische Detailangaben
Hauptverfasser:	IKETANI YUKIHIRO, AIZAWA TAKAHIRO, OTANI KAZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To stably measure the amplitude at the tip of a bonding tool during bonding operation with an ultrasonic wave horn, even if an ultrasonic wave vibration is applied in the direction vertical to a bonding surface. SOLUTION: An ultrasonic wave vibrator system 26 press contacts a tip to an electronic component 4 for pressurizing, and generates ultrasonic wave vibration in the pressurizing direction. A through hole 16 is formed on the ultrasonic wave vibrator system 26 from its base end toward tip side. A laser vibration meter 17A radiates laser beam to the tip through the through hole 16 to observe a reflected light and measures the amplitude at the tip end of the ultrasonic wave vibrator system 26. COPYRIGHT: (C)2004,JPO