MICROPUMP AND COOLING SYSTEM

PROBLEM TO BE SOLVED: To provide a micropump with a simple structure minimizing the leakage of coolant and absorbing the vibration caused by the rotation of an impeller, which is thereby capable of being manufactured at low cost. SOLUTION: The micropump 16 is integrated with a piping tube 1a for con...

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Bibliographische Detailangaben
Hauptverfasser: NAKAI TAKESHI, KITAJIMA HIRONORI, SAKAYORI KAZUSHI, HIROSHIMA KAZUHIKO, NAGAI YASUMUTSU, INUI KENICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a micropump with a simple structure minimizing the leakage of coolant and absorbing the vibration caused by the rotation of an impeller, which is thereby capable of being manufactured at low cost. SOLUTION: The micropump 16 is integrated with a piping tube 1a for connecting a heat-absorbing part for absorbing heat from a heating element and a heat-dissipating part for dissipating heat from fluid absorbed in the heat-absorber part. In the micropump 16, an elastic piping tube 1 serves as a casing. A finned pipe 6 is inserted into the piping tube 1 and supported by a bearing 4 and a retainer 7. The bearing 4 and the retainer 7 are fixed by a band 3 through the piping tube 1a. The finned pipe 6 is provided with a magnet 8 and driven to rotate by a stator 2. An axial flow is generated by a fin 9 of the rotary-driven finned pipe 6, and cooling fluid in the piping tube 1a thereby flows from a suction side to a discharge side. COPYRIGHT: (C)2004,JPO