POLISHING BODY, POLISHING DEVICE EQUIPPED THEREWITH, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

PROBLEM TO BE SOLVED: To meet requirement for elimination of steps and uniformity imposed on a workpiece with sufficient accuracy, and at the same time to improve a yield to a large extent by reducing edge exclusion to a possible narrow range. SOLUTION: A polishing body 40 comprises many projected p...

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Bibliographische Detailangaben
Hauptverfasser:	EZAKI MORIHIKO, SUGAYA ISAO, ITO AKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Zusammenfassung:	PROBLEM TO BE SOLVED: To meet requirement for elimination of steps and uniformity imposed on a workpiece with sufficient accuracy, and at the same time to improve a yield to a large extent by reducing edge exclusion to a possible narrow range. SOLUTION: A polishing body 40 comprises many projected polishing members 43 formed from an elastic material and provided on one surface side of a base plate 41. Each polishing member 43 is so formed that two kinds of materials having different elasticity are stacked in a direction where a projection is extended, and a material forming a layer 46 positioned on the root side of the projection has lower elasticity than a material forming a layer 45 positioned on the tip side of the projection. COPYRIGHT: (C)2004,JPO