POLYMER-BURIED SOLDER BUMP USED FOR RELIABLE PLASTIC PACKAGE ATTACHMENT

PROBLEM TO BE SOLVED: To prevent cracks of solder bumps used in a plastic package of a semiconductor device etc. SOLUTION: The plastic package 41(not shown) used in the semiconductor device includes a plurality of metal terminals exposed on the package surface 41a(not shown) and the metal bumps 42(n...

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Bibliographische Detailangaben
Hauptverfasser:	VARIYAM MANJULA, CHIU TZNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent cracks of solder bumps used in a plastic package of a semiconductor device etc. SOLUTION: The plastic package 41(not shown) used in the semiconductor device includes a plurality of metal terminals exposed on the package surface 41a(not shown) and the metal bumps 42(not shown) deposited on each of the terminals, and the bumps have almost uniform heights formed with a metal which can reflows. The package surface is covered with an adherent layer of a polymer material 44(not shown), and the adherent layer forms a solid meniscus 44a (not shown) surrounding each bumps. The layer has a thickness between 1/4 and 1/2 of the height of the bump. A similar method is applicable to a plastic assembly board. COPYRIGHT: (C)2004,JPO