FLOW SOLDERING DEVICE

PROBLEM TO BE SOLVED: To provide a flow soldering device which realizes a jet waveform of molten solder copying warping of a printed circuit board with a simple configuration, and enables soldering of high quality without causing a solder bridge, etc., in flow soldering. SOLUTION: The flow soldering...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAKAGAMI YUKINOBU, KAWAZOE SHINYA, HAMADA OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flow soldering device which realizes a jet waveform of molten solder copying warping of a printed circuit board with a simple configuration, and enables soldering of high quality without causing a solder bridge, etc., in flow soldering. SOLUTION: The flow soldering device comprises a solder bath 100 keeping solder melting; a solder feeding means 113 pressure-feeding the solder 111 kept melting; a solder jet part 105 generating solder jet 112; a solder forming part which forms the solder on a printed wiring board 101 by bringing the solder jet 112 into contact with the printed wiring board 101; and a rotatable and/or slidable gate valve 108 which is provided to or near the solder jet part 105 for adjusting the solder jet 112 so that the solder jet 112 against the printed wiring board 101 having warping copies the warping when the solder jet 112 contacts to the printed wiring board 101. COPYRIGHT: (C)2004,JPO