PACKAGING METHOD OF ELECTRONIC COMPONENT TO FLAT CABLE AND PACKAGING JOINT

PROBLEM TO BE SOLVED: To obtain a packaging method of an electronic component in a flat cable wherein the electronic component can be electrically connected at a packaging portion without using solder and conductive adhesive. SOLUTION: A connection metal plate 4 is fixed on a portion corresponding t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FUJISAKI ATSUSHI, NAKATANI YOSHIMI, ENOMOTO KENJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a packaging method of an electronic component in a flat cable wherein the electronic component can be electrically connected at a packaging portion without using solder and conductive adhesive. SOLUTION: A connection metal plate 4 is fixed on a portion corresponding to a flat conductor 1 of at least one surface of the flat cable 3. A portion wherein the flat conductor 1 and the connection metal plate 4 are overlapped is cut along two cut lines 6. A part 7a between the two cut lines 6 is made a step-difference in a laminating direction to both sides which intersect the cut lines 6, in such a manner that the connection metal plate 4 in the part exists inside the step-difference direction. Conduction joints 8 with which the connection metal plate 4 and the flat conductor 1 are mutually in contact are formed in ends in a longitudinal direction of the cut lines 6. A connecting conductor 11a of an electronic component is inserted in a gap 9 in the step-difference part between the part 7a between the two cut lines 6 and both of the sides intersecting the cut lines 6. COPYRIGHT: (C)2004,JPO