EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is used for sealing semiconductors, has excellent solder resistance and does not cause the development of cracks and the peeling of substrates in sealed and cured semiconductor devices, even when treated with solders after the absorpti...

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Bibliographische Detailangaben
1. Verfasser:	SAKUMICHI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is used for sealing semiconductors, has excellent solder resistance and does not cause the development of cracks and the peeling of substrates in sealed and cured semiconductor devices, even when treated with solders after the absorption of moisture, and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition for sealing the semiconductors, comprising (a) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) a phosphazene compound, (E) silica and (F) at least one silane coupling agent selected from the group consisting of γ-aminopropyltriethoxyisilane, γ-aminopropyltrimethoxysilane, γ-glycidylpropyltriethoxysilane, and γ-glycidylpropyltrimethoxysilane as essential components, is characterized by treating the surface of (E) the silica with (F) at least one silane coupling agent selected from the group. COPYRIGHT: (C)2004,JPO