SEMICONDUCTOR PACKAGING DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor packaging device or a semiconductor module that is improved than before. SOLUTION: A semiconductor packaging device 58 includes a first substrate 60 for bonding electronic components 64 and a second substrate 62 for accommodating the electronic compon...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor packaging device or a semiconductor module that is improved than before. SOLUTION: A semiconductor packaging device 58 includes a first substrate 60 for bonding electronic components 64 and a second substrate 62 for accommodating the electronic components that are bonded by the first substrate 60. COPYRIGHT: (C)2004,JPO |
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