SYSTEM FOR AND METHOD OF AUTOMATICALLY INSPECTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of automatically inspecting an X-ray mask or an equivalent electrically conductive substrate using charged particles at low cost. SOLUTION: By measuring the position of the substrate, a charged-particle beam is accurately positioned on the substrate. The cha...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GREEN JOHN, JOHN GIBIRISUKO, LING MING-YIE, WIECZOREK PAUL, ROUGH KIRKWOOD, TAYLOR JOHN, SIMMONS RICHARD, DUTTA APRIL, HUTCHESON TIMOTHY L, KIRK CHRIS, PAUL RAY, OYANG YEN-JEN, DESAI ANIL, WALTERS DEAN, DOHSE HANS, PAUL SANDLAND, SMITH DAVID E A, WONG SAM, VENEKLASEN LEE, NGUYEN HOI ZA, ROBINSON MIKE, LELE SURENDRA, MCMURTRY JOHN, MEISBURGER DAN, JAU JACK Y, JOHNSON RALPH, PEARCE-PERCY HENRY, EMGE DENNIS, BRODIE ALAN D, BECKER BERRY, CHADWICK CURT, JESSIE LYNNE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING ELECTRIC VARIABLES MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING MAGNETIC VARIABLES ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of automatically inspecting an X-ray mask or an equivalent electrically conductive substrate using charged particles at low cost. SOLUTION: By measuring the position of the substrate, a charged-particle beam is accurately positioned on the substrate. The charged-particle beam is deflected to a desired position of the measured substrate. The desired position of the surface of the substrate is scanned with the charged-particle beam. As a result, at least one type of charged particles are detected among secondary charged particles generated from the top surface and the bottom surface of the substrate, back scattered charged particles, and transmitted charged particles. The substrate is automatically inspected using charged particles according to the steps. COPYRIGHT: (C)2004,JPO