EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS

EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which has excellent properties of flame retardance, moldability and high-temperature storage properties even without containing a halogen-based flame retardant and an antimony compound. SOLUTION: The epoxy resin c...

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1. Verfasser: FUJIEDA YOSHIO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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description PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which has excellent properties of flame retardance, moldability and high-temperature storage properties even without containing a halogen-based flame retardant and an antimony compound. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a phenol resin, (B) a triazine-modified phenol novolak resin, (D) an organopolysiloxane represented by general formula (1) (R is a monohydric organic group, 30-100 wt.% of the whole organic groups is a phenylene group and the residual organic group is one or more groups selected from the group consisting of a vinyl group-substituted organic group, a 1-6C alkylalkoxy group, a 1-6C alkyl group, an amino group-substituted organic group, an epoxy group-substituted organic group, a hydroxy group-substituted organic group and a mercapto group-substituted organic group; n is an average value and a positive number of 5-100), (E) a curing promoter and (F) an inorganic filler as essential components. The amount of the triazine-modified phenol novolak resin is 0.1-3 wt.% in the whole epoxy resin composition. COPYRIGHT: (C)2004,JPO
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SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a phenol resin, (B) a triazine-modified phenol novolak resin, (D) an organopolysiloxane represented by general formula (1) (R is a monohydric organic group, 30-100 wt.% of the whole organic groups is a phenylene group and the residual organic group is one or more groups selected from the group consisting of a vinyl group-substituted organic group, a 1-6C alkylalkoxy group, a 1-6C alkyl group, an amino group-substituted organic group, an epoxy group-substituted organic group, a hydroxy group-substituted organic group and a mercapto group-substituted organic group; n is an average value and a positive number of 5-100), (E) a curing promoter and (F) an inorganic filler as essential components. The amount of the triazine-modified phenol novolak resin is 0.1-3 wt.% in the whole epoxy resin composition. 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subjects BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS
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