EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which has excellent properties of flame retardance, moldability and high-temperature storage properties even without containing a halogen-based flame retardant and an antimony compound. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a phenol resin, (B) a triazine-modified phenol novolak resin, (D) an organopolysiloxane represented by general formula (1) (R is a monohydric organic group, 30-100 wt.% of the whole organic groups is a phenylene group and the residual organic group is one or more groups selected from the group consisting of a vinyl group-substituted organic group, a 1-6C alkylalkoxy group, a 1-6C alkyl group, an amino group-substituted organic group, an epoxy group-substituted organic group, a hydroxy group-substituted organic group and a mercapto group-substituted organic group; n is an average value and a positive number of 5-100), (E) a curing promoter and (F) an inorganic filler as essential components. The amount of the triazine-modified phenol novolak resin is 0.1-3 wt.% in the whole epoxy resin composition. COPYRIGHT: (C)2004,JPO