IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To manufacture an imaging device with a thinner film and light weight by a simplified process and improve productivity thereof. SOLUTION: A chip for digital signal processing (DSP) is stuck to a first surface of a substrate. A chip for a CMOS image sensing (CIS) is stuck to the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KYO SHIIN, RO YOUNG HOON, CHO MIN KYO, KEN NEISHIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To manufacture an imaging device with a thinner film and light weight by a simplified process and improve productivity thereof. SOLUTION: A chip for digital signal processing (DSP) is stuck to a first surface of a substrate. A chip for a CMOS image sensing (CIS) is stuck to the active surface of the DSP chip. The DSP chip and the CIS chip are electrically connected to the substrate by wire bonding. A housing kit with a lens is structured so as to transmit an image to the DSP chip mounted on the substrate. COPYRIGHT: (C)2004,JPO