COOLING DEVICE FOR ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a cooling device for an electronic apparatus at a low cost wherein an arrangement space can be small. SOLUTION: In one casing 21, a liquid circulating pump 22 and a heat receiving part 23 which receives heat abutting against a heat generating part are linked side-by...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAI TAKESHI, KITAJIMA HIRONORI, SAKAYORI KAZUSHI, HIROSHIMA KAZUHIKO, NAGAI YASUMUTSU, INUI KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooling device for an electronic apparatus at a low cost wherein an arrangement space can be small. SOLUTION: In one casing 21, a liquid circulating pump 22 and a heat receiving part 23 which receives heat abutting against a heat generating part are linked side-by side and are arranged. COPYRIGHT: (C)2004,JPO