HOLOGRAM PROCESSING METHOD

PROBLEM TO BE SOLVED: To reliably attach a hologram to a body to be processed of a nonplanar plane. SOLUTION: A tape 11 for forming hologram is provided with a substrate layer 12, a hologram layer 13 and a transfer peeling layer 14. The transfer peeling layer 14 of the tape 11 for forming hologram i...

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Bibliographische Detailangaben
Hauptverfasser: OWATARI AKIO, NAKAMURA HIROTO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To reliably attach a hologram to a body to be processed of a nonplanar plane. SOLUTION: A tape 11 for forming hologram is provided with a substrate layer 12, a hologram layer 13 and a transfer peeling layer 14. The transfer peeling layer 14 of the tape 11 for forming hologram is allowed to contact with the side surface 15a of the body 15 to be processed and is pressurized from the side of a substrate layer 12 of the tape 11 for forming hologram by a thermal head 17. In such a state, the thermal head 17 is subjected to reciprocating movement in the width direction of the tape 11 for forming hologram. Then, the tape 11 for forming hologram and the body 15 to be processed are moved in the arrow direction. Further, the thermal head 17 is controlled so as to be switched to a heating state and a non-heating state while allowing the thermal head 17 to contact with the tape 11 for forming hologram. The transfer peeling layer 14 on the heated part is fused on the body 15 to be processed and, when the tape 11 for forming hologram is separated from the body 15 to be processed, the transfer peeling layer 14 on the heated part and the hologram layer 13 remains on the body 15 to be processed and becomes the hologram H. COPYRIGHT: (C)2004,JPO