FLUID NOZZLE

PROBLEM TO BE SOLVED: To provide a fluid nozzle for uniformly ejecting a liquid from an entire slit-like nozzle hole. SOLUTION: In the fluid nozzle having a fluid feed pipe 2 on one side edge part of an upper surface of a nozzle body 1 of a horizontally long shape, and a slit-like nozzle hole 3 in a...

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Bibliographische Detailangaben
Hauptverfasser:	NASU KENICHI, YAMADA TSUMORU, NOGUCHI MASATAKA, FURUBAYASHI SHINJI, YAKUBO TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a fluid nozzle for uniformly ejecting a liquid from an entire slit-like nozzle hole. SOLUTION: In the fluid nozzle having a fluid feed pipe 2 on one side edge part of an upper surface of a nozzle body 1 of a horizontally long shape, and a slit-like nozzle hole 3 in a lower end part, a rectifying plate 4a inclined toward a center is provided on a lower part of the fluid feed pipe 2, and a rectifying plate 4b inclined in a similar manner to the rectifying plate 4a is provided on a corner part on the other end side. COPYRIGHT: (C)2004,JPO