GRINDING METHOD AND SURFACE GRINDER USING THIS METHOD OR GRINDING CENTER

PROBLEM TO BE SOLVED: To provide a grinding method and a device enhancing processing accuracy by removing an influence to the processing accuracy caused by a mounting error of a grinding wheel and a blade tool, and abrasion when continuously processing by an NC machine tool or the like. SOLUTION: Th...

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Bibliographische Detailangaben
Hauptverfasser: HIDAKA HIROYUKI, SATO MASATOSHI, MISHIMA HIDEKI, MATSUURA TAKAYUKI, KUROKI KIYOSHI, MATSUURA AKIHIKO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a grinding method and a device enhancing processing accuracy by removing an influence to the processing accuracy caused by a mounting error of a grinding wheel and a blade tool, and abrasion when continuously processing by an NC machine tool or the like. SOLUTION: The grinding working method is characterized in that in the working device for carrying out a groove processing of an equal pitch or a cutting processing on the work W on a table T using the grinding wheel G, a CCD camera D1using a telecentric optical system is installed opposed to the work W, a processing position and a width SW of groove are detected after the groove processing; a deviation of the processing position in a grinding wheel shaft direction is calculated from these position data and the groove width data; and a subsequent feed amount of the grinding wheel is obtained by adding the cut groove width to a target dimension of the work. COPYRIGHT: (C)2004,JPO