SOLDER-PASTE PRINTING METHOD AND APPARATUS

PROBLEM TO BE SOLVED: To suppress increase in the viscosity of a solder paste which occurs during a solder-paste printing process. SOLUTION: A solder-paste printing apparatus 1 has a printing-oriented mask 10 having openings 10a each corresponding to each land 6 of a printed wiring board 5, and has...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI MOTOHARU, SAKAI HIROSHI, TANAKA AKIHIRO, IGARASHI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES STAMPS TRANSPORTING TYPEWRITERS
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